ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 description ST3406SRG is the nchannel logic enhancement mode p ower field effect transistor which is produced using high cell density, dmos tre nch technology. this high density process is especially tailored to minimize onstate resistance. these devices are particularly suited for low voltage application suc h as cellular phone and notebook computer power management, other battery powered ci rcuits, and low inline power loss are required. the product is in a very small o utline surface mount package. pin configuration sot-23 1.gate 2.source 3.drain part marking sot-23 y: year code a: week code feature 30v/5.4a, r ds(on) = 26m(typ.) @v gs = 10v 30v/4.6a, r ds(on) = 38m @v gs = 4.5v super high density cell design for extremely low r ds(on) exceptional onresistance and maximum dc current capability sot23 package design 3 1 2 d g s 3 1 2 a6ya
ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 absoulte maximum ratings (ta = 25 unless otherwise noted ) parameter symbol typical unit drainsource voltage v dss 30 v gatesource voltage v gss 20 v continuous drain currenttj=150 ) t a =25 t a =70 i d 5.4 3.2 a pulsed drain current i dm 25 a continuous source current (diode conduction) i s 1.7 a power dissipation t a =25 t a =70 p d 2.0 1.3 w operation junction temperature t j 150 storgae temperature range t stg 55/150 thermal resistancejunction to ambient r ja 90 /w
ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 electrical characteristics ( ta = 25 unless otherwise noted ) parameter symbol condition min typ max unit static drainsource breakdown voltage v (br)dss v gs =0v,i d =250ua 30 v gate threshold voltage v gs(th) v ds =vgs,i d =250ua 1.0 3.0 v gate leakage current i gss v ds =0v,v gs = 20v 100 na zero gate voltage drain current i dss v ds =24v,v gs =0v 1 ua v ds =24v,v gs =0v t j =55 10 drainsource onresistance r ds(on) v gs =10v,i d =4.0a v gs =4.5v,i d =3.6 a 26 38 m forward transconductance g fs v ds =4.5v,i d =5.4a 12 s diode forward voltage v sd i s =1.7a,v gs =0v 0.8 1.2 v dynamic total gate charge q g v ds =15v v gs =10v i d 6.7a 10 18 nc gatesource charge q gs 1.6 gatedrain charge q gd 3.1 input capacitance c iss v ds =15v v gs =0v f=1mh z 450 pf output capacitance c oss 240 reverse transfer capacitance c rss 38 turnon time t d(on) tr v dd =15v r l =15 i d =1.0a v gen =10v r g =6 7 15 ns 10 20 turnoff time t d(off) tf 20 40 11 20
ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 typical characterictics (25 unless otherwise noted)
ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 typical characterictics (25 unless otherwise noted)
ST3406SRG n channel enhancement mode mosfet 5.4a stanson technology 120 bentley square, mountain view, ca 94040 usa http://www.stansontech.com ST3406SRG 2006. v1 sot-23 package outline
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